5 Significant Multilayer PCB Advantages for PCB Design Application

These types of PCBs offer a range of benefits. One of the most common reasons for using the multilayer PCB is the size. Because of the layered design, it means that the PCB will be smaller than other printed circuit boards but still have the same level of functionality. Most people today want their electronics to be smaller, while still being powerful. The multilayer PCB allows for this. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } These types of boards also happen to weigh less, which helps to reduce the overall weight of the gadgets in which they are used. However, the size is certainly not the only benefit. If you are going to learn more about multilayer PCB, please check and read more professional knowledge in the content below. Better performance of multilayer PCB There are many reasons to use a multilayer board rather than just saving space. Multiple layers in your PCB solve electrical performance issues, including the following: · EMI Shielding: With a multilayer board, you can configure the layer structure to include multiple ground planes. The planes shield against incoming electromagnetic interference that can abuse the board’s circuits and stop any outgoing EMI emissions. · Signal integrity: Multilayer boards can be configured with microstrip or stripline layer structures to sandwich high-speed transmission lines between them. These structures will provide better signal return paths, reducing noise on the board and controlling crosstalk and broadside coupling between signal traces. What are the 5 main advantages of multilayer PCB? From a technical point of view, multilayer PCBs present several advantages in design. These benefits multilayer PCBs present include: 1. Small Size: One of the most prominent and lauded benefits of using multilayer PCBs lies in their size. Because of their layered design, multilayer PCBs are inherently smaller than other PCBs with similar functionality. This presents a major benefit to modern electronics, as the current trend is working toward smaller, more compact yet more powerful gadgets like smartphones, laptops, tablets and wearables. 2. Lightweight Construction: With smaller PCBs comes less weight, especially as the multiple connectors required to interlink separate single and double-layered PCBs are eliminated in favor of a multilayered design. This, again, is beneficial for modern electronics, which are geared more toward mobility. 3. High-Quality: Due to the amount of work and planning that must go into the creation of multilayer PCBs, these types of PCBs tend to be better in quality than single and double-layer PCBs. They also tend to be more reliable as a result. 4. Increased Durability: Multilayer PCBs tend to be durable by their nature. Not only do these multilayer PCBs have to withstand their own weight, but they must also be able to handle the heat and pressure used to bind them together. On top of these factors, multilayer PCBs use multiple layers of insulation between circuit layers, binding it all together with prepreg bonding agent and protective materials. 5. Enhanced Flexibility: Though this does not apply to all multilayer PCB assemblies, some do use flexible construction techniques, resulting in a flexible multilayer PCB. This can be a highly desirable trait for applications where mild bending and flexing may occur on a semi-regular basis. Again, this does not apply to all multilayer PCBs, and the more layers incorporated into a flexible PCB, the less flexible the PCB becomes. What are the applications according to the advantages of multilayer PCB? Owing to its lightweight weight and compact designs, multilayer PCBs are considered to be the best choice for various industrial applications. The following are some important applications of multilayer PCBs: Medical Devices Electronic devices are integral to the medical industry. Like any other electronics dependent industry, the medical industry is also adopting miniaturization. With non-invasive treatment techniques gaining traction, there is increased demand for miniature devices in the medical industry. The multilayer PCBs can perfectly meet the demands of these devices owing to their small size, lightweight design, and other powerful features. Some best examples of medical devices using multilayer PCs include X-ray equipment, CAT scanning equipment, blood pressure, and sugar testing device, MRI, CT scan, infrared temperature monitoring, and so on. Consumer Electronics Consumer electronics, often referred to as home electronics, covers a wide range of electronics equipment intended for everyday use. This tends to include devices used for communication such as smart phones, laptops, etc.; entertainment including smart TVs, music players; and kitchen appliances – microwaves, washing machines, and more. Most of these devices are equipped with multilayer printed circuit boards than standard single-layer PCBs. Why? This is because multilayer PCBs contribute to their functionality and compact designs. Industrial Electronics Electronics equipment used in an industrial environment is quite different from consumer electronics. The reason being they are exposed to harsh environments such as high temperature, shock, vibrations, pressure, dust, and humidity. Some common examples of industrial electronics equipment include automated assembly lines, packaging conveyors, spray painting robots, and so on. They are designed for long time functioning and they may be made to work throughout the day. In such cases, durable PCBs are required, and multilayer PCBs exactly meet this requirement. Multilayer PCBs are more durable than other alternatives available on the market today. Computers and Devices Today, it is impossible for us to imagine life without computers and automation. Everything right from computers and related products such as graphics cards, motherboards, computer mouse, and more uses multilayer PCBs, owing to their space-saving and functionality attributes. These PCBs can be designed to achieve superior performance at low costs than other competitive technologies. Telecommunication Electronics Multilayer PCBs are found in many telecommunication devices such as GPS and satellite applications, signal transmission, which demands durability while maintaining a high level of functionality. With the development of wireless technologies, there is a high demand for high-performance, sophisticated miniature devices. Multilayer PCBs can easily fulfill the requirement. Other applications of telecommunication electronics are communication towers, Radar electronics, power amplifiers, attenuators, and many more.

PCB Knowledge ⋅ 10/26/2021 09:19

5 Main Tips of Ceramic PCB Manufacturing Process for Beginners

The word ceramic refers to a group of materials with chemical structures and physical qualities that are similar. Ceramic printed circuit boards (PCBs) have a ceramic base material made up of highly thermally conductive materials, including alumina, aluminum nitride, and beryllium oxide. Ceramic printed circuit boards have proven instrumental in the creation of smaller electronic devices. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } Are you interested in ceramic PCB manufacturing? Do you want to learn more about ceramic PCB? If you are going to get more information about ceramic PCB manufacturing, please check and read the content we prepare below. 1. What are the advantages of ceramic PCB? Besides its enviable thermal properties and low CTE, ceramic PCBs come with a few other benefits. Review some of their advantages below: · Safe operation in temperatures up to 350 degrees Celsius · Simple implementation of high-density tracing · Exceptional high-frequency performance · Versatile packaging, with an option to come in hermetic packages to prevent water absorption · Tough chemical erosion resistance 2. What are the main types of ceramic PCB? High temperature As you know, high temperature may be the most popular types pf ceramic. In general, The ceramic PCB designed for high temperatures is often regarded as high temperature co-fired ceramic (HTCC) circuit, which is made up of raw ceramics with solvent, mixing adhesive, plasticizer, lubricant as well as aluminum oxide. First of all, it fabricates with the raw ceramic material, secondly coat the material, and then carry out the circuit tracing on tungsten or molybdenum metals. Finally, if the circuit tracing is achieved, it can bake the boards between 1600 and 1700 degrees Celsius for up to 48 hours after lamination. All HTCC baking is done in a gaseous environment, such as in hydrogen gas. Thick film ceramic Thick film ceramic PCB, the thickness of its conductor layer may exceed 10 microns, but not more than 13 microns. In general, the conductor layer is printing the silver or gold palladium on the surface of ceramic PCB. That is to say, thick film ceramic PCB includes gold and dielectric pastes, which is done on a ceramic base material, and the pastes and backed at a temperature of 1000 degrees Celsius or below after working. So the thick film ceramic PCB is widely used for most PCB manufacturers because of the high cost of gold conductor paste. The main advantage of thick film ceramic PCB over traditional PCB is that thick film ceramic can protect copper from oxidizing. So a ceramic PCB manufacturer can put interchangeable conductors, semi-conductors, conductors, electric capacitors, or resistors on the ceramic board. After achieving the process of printing and high-temperature sintering, all the components on the board can be laser-trimmed to their desired values. 3. What is the manufacturing process of ceramic PCB? Traditional ceramic substrate manufacturing methods can be divided into four types: HTCC, LTCC, DBC, and DPC. · The HTCC (high temperature co-fired) preparation method requires a temperature above 1300°C, but due to the choice of the electrode, the preparation cost is quite expensive. · The LTCC (low temperature co-firing) requires a calcination process of about 850°C, but circuit precision is poor, and the thermal conductivity is low. · The DBC requires formingan alloy between the copper foil and the ceramic, and the calcination temperature needs to be strictly controlled within the temperature range of 1065-1085°C. Because the DBC requires the thickness of the copper foil, generally, it cannot be less than 150-300 microns. Therefore, the wire width to depth ratio of such ceramic circuit boards is limited. · The preparation methods of DPC include vacuum coating, wet coating, exposure and development, etching, and other process links, so the price of its products is relatively high. In addition, in terms of shape processing, DPC ceramic plates need to be laser cut. Traditional drilling and milling machines and punching machines cannot accurately process them, so the bonding force and line width are more precise. 4. What are the properties of ceramic PCB? Compared with traditional PCBs whose substrate materials are epoxy glass fiber, polyimide, polystyrene and phenolic resin, ceramic PCBs feature the following properties: • Excellent thermal conductivity • Chemical erosion resistant • Agreeable mechanical intensity • Compatible with CTE of components • Easy to implement high-density tracing. Due to increasingly multiple functions, miniaturization and high speed of electronic devices and upsizing of IC, more rigorous requirement has to be set to ceramic PCBs in terms of CTE, thermal conductivity, loss, dielectric constant and tape resistance. It can be estimated that ceramic PCBs will be increasingly more called for with aluminum nitride, mullite and glass ceramic as substrate material. 5. What are the applications of ceramic PCB? Multi-layer interconnect board To be compatible with miniaturization of electronic products, ceramic PCBs are able to hold more components within the same board area, which adds more possibilities for ceramic PCBs in the applications of multi-layer interconnect board. Digital PCB AGC Company from Japan took advantage of LTCC PCBs to produce analog/digital PCB boards so that parasitic capacitance can be reduced by approximately nine tenths. It not only effectively overcomes crosstalk interference of circuit tracing, but also reduces volume and weight of circuit.

PCB Knowledge ⋅ 10/26/2021 09:09

How to Design RF PCB with 7 Most Reliable Tips?

RF PCBs are one of the fastest growing sectors in PCB manufacturing. With with proliferation of IoT sensors, wireless electronics, and smart phones, it’s easy to see why. But how do you know if you’re working on an RF PCB? The PCB industry considers any board that operates above 100MHz to be an RF PCB. Anything about 2GHz is a Microwave PCB. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } Are going to learn more about RF PCB design? If you are interested in RF PCB design, you can choose to check and read the content below for more information. 1. How to transmit line layers of RF PCB? Does your RF layout require you to move a transmission line between layers? Maxim recommends using at least two via holes for each transition point to minimize via inductance loading. The width of these transition vias will need to match the width of the transmission lines. Used effectively, these vias can help to cut transition inductance by 50%. 2. How to select right material for RF PCB? Materials commonly used in PCB fabrication, such as FR-4 (flame retardant level 4), are very cheap but are generally not the most suitable choice for high frequency RF applications, especially considering the non-uniformity of the dielectric constant and a worse tangent angle. For RF PCBs, specific materials are used, such as FEP, PTFE, ceramic, hydrocarbons, and various types of glass fiber. The PFE and PTFE materials, belonging to the fluoropolymer family, improve the chemical resistance of the base material, have anti-adhesion and smoothness properties, as well as an extraordinary heat resistance. If budget is not a problem and quality is more important than price, the best solution is PTFE with fiberglass, eventually woven glass fiber. 3. How to process the isolation of RF PCB? Particular attention must be paid to avoid dangerous couplings between the signals. The RF transmission lines should be kept as separate as possible from other traces (especially if crossed by high-speed signals such as HDMI, Ethernet, USB, clock, differential signals, etc.) and not travel long stretches parallel to each other. The coupling between parallel microstrips, in fact, increases as the distance that separates them decreases and the distance traveled in the parallel direction increases. Similarly, traces carrying high-power signals should also be isolated from other parts of the circuit. An excellent insulation value can be obtained by using the grounded coplanar waveguides. Traces carrying high-speed signals should be routed on a different layer than RF signals, in order to avoid coupling phenomena. The power supply lines should also be routed on dedicated layers, by inserting suitable decoupling/bypass capacitors. 4. How to process routing for RF PCB? The ground wire should be as thick as possible. If it is possible, each layer of the PCB should be grounded as much as possible, and the ground should be connected to the main ground. More ground vias should be made to reduce the ground impedance as much as possible. The power supply of the RF circuit should not be divided into planes as much as possible. The entire power plane not only increases the radiation of the power plane to the RF signal, but also is easily interfered by the RF signal. Therefore, the power cord or plane generally adopts a long strip shape and is processed according to the size of the current. It is as thick as possible under the premise of meeting the current capacity, but it cannot be widened without limit. When handling power lines, be sure to avoid loops. The direction of the power line and the ground line must be parallel to the direction of the RF signal but not overlap. It is best to use a vertical cross where there is a cross. 5. How to process the component placement for RF PCB? When placing components on an RF circuit board, the needs of the circuitry often demand a tighter part placement. Modifying the component placement is one of those compromises that the designer must carefully manage to ensure that the board can still be built with standard automated assembly equipment to keep production costs from escalating. RF boards also tend to have more metal on the external layers for their power networks, and components are often placed directly on those areas. While this connection may be better for the performance of the RF circuitry, it can cause problems for PCB assembly. Another aspect of RF PCBs to keep in mind is that the components may require altering during layout. These can range from changing the size and shape of the PCB footprint pads to incorporating specific metal features and shapes into the footprint. Work like this is usually done individually to components on the board instead of altering the base library part. Next, we’ll list some of the routing requirements you may encounter on an RF PCB design. 6. What are the regular rules for RF PCB design? These will include: Design for Manufacturing (DFM) rules. If your design can’t be built because of basic DFM rules violations, you’ve got a much bigger problem on your hand. This includes designing your board for both assembly and test (DFA & DFT). Keep in mind the basic PCB design rules for digital, analog, power, and mixed signal technologies. Just because you need more room for high speed traces or RF shielding doesn’t mean that you can ignore your regular PCB design spacing rules and squeeze things together. Thermal issues with components run hot. High speed circuitry tends to generate more heat, and you need to keep thermal issues in mind now more than ever. Make sure that you board is getting cooled the way that it should be. 7. How to process high-speed RF PCB？ For success in routing high speed and RF circuitry on your PCB design, you need to follow some basic guidelines that will help you to avoid the more common problems. One of the first is to make sure that your schematic is set up with enough information to help the designers in layout with their routing. Another is to know precisely what materials and stackup configuration your high speed or RF design needs so that critical design data such as trace widths and spacing don’t change in mid-layout. Component placement also needs to be precise in order to produce short and direct signal paths, while high speed trace routing needs to follow topology patterns designed to create the best signal integrity performance.

PCB Knowledge ⋅ 10/25/2021 10:48

How to Protect PCB from ESD through 5 Effective Tips?

ESD is a tiny amount of lightning, similar to what happens during thunderstorms, only in a miniature form. According to the laws of physics, the electromotive force causes a massive amount of current flow through a path offering the lowest resistance. In most cases, the discharging current travels to ground via the metal chassis or frame. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } Are you going to learn the methods to protect PCB from ESD damage? If you are interested in PCB ESD damage, please check and read this passage for more information. 1. What are the damages caused by ESD to PCB? When a PCB assembly comes close to any object that has a charge, there is a possibility of an ESD. This depends on the electromotive force between the two and the distance separating them, with the greatest chance of an ESD taking place when the two touch. Although manufacturers build different protection mechanisms within ICs, ESD can as much as totally ruin an IC. This damage may be of two types—latent or catastrophic. When a device suffers latent damage due to ESD, it may be partly degraded, and continue to run. However, the device becomes unreliable as its lifetime reduces, and its operational behavior affected. A bare PCB may also suffer latent damage. For instance, there can be an electrical discharge from one neighboring track to another, if the latter is connected to ground. The discharge can char the top layer of the PCB insulation, causing a partially conducting path. This can affect the performance of the circuit after assembly. 2. When does ESD affect on PCB? Electrostatic discharge (ESD) occurs when two objects with different charges get close enough, or charged enough, to break down (ionize) the dielectric between them. For consumer products, ESD and dielectric breakdown in air usually occurs when the electric field between two points is greater than 40 kV/cm. Things like air pressure, temperature, and humidity will affect this electric field strength. For example, high humidity in some environments can cause the air to be more conductive, which will dissipate some charge and increase the voltage required to ESD. One common misconception is that a specific voltage is needed to cause ESD. This is not exactly correct; the voltage required to produce ESD is dependent on the voltage between two points and the distance between those points. This is why, in PCBs, we have a limits on the clearance between conductors (creepage and clearance) as specified in the IPC-2221 standards. 3. How to protect PCB from ESD through components controlling? Component identification: Although sensitive devices are pre-packaged from the manufacturer in static controlled containers, it is still important for the PCB CM to identify which components are more sensitive than others, and handle them appropriately. Not only is this important for ESD, but for moisture-sensitive parts as well. Component handling: Once the components are in-house, the PCB CM needs to follow documented procedures for handling them. This includes their use within designated ESD protected areas of the manufacturing floor and ensuring that assembly technicians are trained and prepared for working with these parts. 4. How to protect PCB from ESD through layout? Apart from this, a whole lot of PCB Layout practices can go a long way in protecting PCB. These include: Remove circuit loops Loops can lead to unwanted current. This in turn affects performance as unwanted current spikes can enter any loop. Due care therefore needs to be taken to ensure there are no loops. Utilize ground plane layers in the printed circuit board Using a ground plane within a circuit board can go a long way in helping to reduce loops and therefore unwanted current. Reduce line lengths Reducing line length in effect reduces the radiated energy received and therefore reducing the spikes from electrostatic discharges. Reduce parasitic inductance Protection circuits can only work effectively if parasitic inductance levels are low. In turn parasitic inductance can be reduced by keeping the line lengths short. 5. How to handle PCB from ESD damage? ESD damage to unprotected sensitive devices may occur at any time. ESD events can occur far below the threshold of human sensitivity. Follow this sequence when it becomes necessary to install or remove a circuit board: After you are connected to the grounded wrist strap, remove the circuit board from the frame and place it on a static controlled surface (grounded floor or table mat). · Remove the replacement circuit board from the static-shielding bag or clamshell and insert it into the equipment. · Place the original board into the shielding bag or clamshell and seal it with a label. · Do not put repair tags inside the shielding bag or clamshell. · Disconnect the wrist strap.

PCB Knowledge ⋅ 10/25/2021 10:35

How to Reduce PCB Cost with 5 Efficient Methods for PCB Manufacturers?

Reducing the cost of printed circuit boards is really about keeping things simple and effective, designed to achieve your goals and your needs in as direct a way as possible. PCBs are usually seen as a complex dance of getting everything to fit in the smallest space or trying to space everything out as much as possible to make them easy to read. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } There is indeed a happy medium somewhere. You can reduce the cost of PCBs by looking for this middle ground. In this piece, we’ll present seven of those in-between spaces for reducing the cost of printed circuit boards. If you are going to know the methods of reducing PCB cost, check and read the content below for more information. 1. Why to reduce PCB cost? It continually faces stiff competition and regulations. The PCB Manufacture processing itself is driven by many variables that can independently affect the overall board price. Manufacturers and the users control some of the factors that affect the cost. But then, some elements are beyond the reach of both. Among such factors are conditions like exchange rates, utility tariffs, material cost, among many others. So, understanding all these factors helps you know the value of the printed circuit board through evaluating the manufacturing process. Sometimes, the users can also make decisions that can influence the cost from his/their side. The most obvious ways of reducing cost are: making the boards as simple as possible, using fewer components, and reducing the board complexity. At times, you might also consider using basic shapes as much as possible, ordering a large batch quantity, and of course, using the least expensive service available. 2. How to streamline the PCB layout and Design? · Make sure that each portion of the design is reviewed and signed off to reduce rework. If you have team sharing software, this can help speed up the design review process. But even the standard design review meeting can be enhanced with projected views of the design that highlight specific components and sensitive nets and trace routing. · Have a well-developed design library in place so that you aren’t continually rebuilding the same parts. Another option is to use a PCB library vendor that can provide component symbols and footprints directly from the part manufacturer. · Save and reuse common areas of circuitry to save a lot of time and effort in the same way that a design library can. · Make sure that your design data is backed up and protected against data loss. 3. How to define the right board size and standard thickness? Board format has a high impact on the wiring process: if the PCB is small and complex, more time and effort will be needed for the assembler to complete it. Highly compact sizes will always be expensive. So it’s always a good thing to save space, we recommend not reducing it more than necessary to avoid multiple operations on the same board. Once again, remember that complex forms have an impact on the price: a square or rectangular PCB will allow you to keep control. The more you increase PCB thickness, the higher the manufacturing costs...in theory anyway! The number of layers you select has an influence on the board vias (types and diameters). Your overall board costs can be reduced if the board is thinner, but may require more holes and some machines can sometimes not be used with thinner PCBs. What will help you make savings is to discuss it with your supplier early on! 4. How to prepare for BOM to reduce cost? BOM, short for bill of materials, is a comprehensive list of raw materials, items, assemblies and sub-assemblies, components etc. for product manufacturing. You might think creating a BOM is much easier than making the Gerber file while we found more mistakes tend to be made in BOM then in Gerber files. A complete BOM should include essential items for PCBA including Part number, Manufacturer name, Reference designator, Quantity, Description, Case/Package, SMT method, Top/Bottom, Points/Footprint, Comment/Note, BOM level, Comment/Note. Usually, PCB Assemblers have their in house BOM template and BOM creating guidelines, which you can fill in accordingly and speed up the quotation procedure. It's highly recommended to add components replacement in your BOM. As electronics is developing super fast, components upgrade rapidly with old items eliminated. Though your PCB assembler will inform you about items that went out of production, time will be wasted to locate the replacement and production will be delayed accordingly. With the complete BOM and replacement provided, PCB assembler can quote in just one or two days and start the production with your confirmation. It's always good to look forward and be fully prepared for any kind of emergency. 5. How to make the component source of PCB? If you’re with a company of small size, it’s hard to control your budget and project schedule. Under this circumstance, relying on a PCB assembler will make more sense. PCB assemblers are more likely to have friendly relationships with franchised component distributors due to their long-term cooperation. They can get your needed components from those distributors at a wholesale price, which is much lower than retail price. To evaluate a PCB assembler that has genuine cooperation with franchised component distributors, you can ask for its purchase invoice from distributors.

PCB Knowledge ⋅ 10/25/2021 10:18

What is ENEPIG Finish in PCB Manufacturing Process for Beginners?

ENEPIG is a kind of selective surface processing technology, is also a kind of new surface treatment technology, the principle for the PCB copper layer on the surface of the plating layer of nickel, palladium and gold, the main process includes: PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } Do you want to know ENEPIG finish in PCB? Do you want to learn more information about ENEPIG finish in PCB? Please check and read the content below for more professional knowledge. What are the features of ENEPIG finish in PCB? · For wire bonding applications, the pull strength is of high importance. ENEPIG offers a greater pull strength (aluminum wire: up to 10 gram-force; gold wire: up to 8 gram-force) than soft gold and ENIG (Electroless Nickel Immersion Gold). Hence, becomes the right choice. · The multiple electroless deposition of nickel, palladium and gold metals help minimize porosity and protects the cupper layer beneath them. · While dealing with high-frequency circuits, nickel might interfere and retard high-frequency signals. With the palladium layer on top of nickel, it can negate the influence of nickel on high-frequency signals. · In mixed technology i.e. when RF and digital circuits are involved, opting for direct gold surface finish will lead to assembly related issues. Whereas, ENEPIG is compatible with mixed technology and the various assembly processes. · ENEPIG surface finish is the low-cost alternative to direct soft gold plating. ENEPIG surface finish is ideal for soldering, aluminum wire bonding, and gold wire bonding. This surface finish is formed by the sequential deposition of nickel, followed by palladium, followed by immersion gold. The Nickel acts as a barrier layer and reduces copper dissolution during wave solder, and ensures fine solderability. Nickel also prevents the mixing of copper and solder. What are the advantages of ENEPIG finish in PCB? Nickel electroplating through the electroplating method, the gold particles are attached to the PCB board. It is also known as hard gold because the adhesion is strong. Using this process can greatly increase the hardness and wear resistance of the PCB. Also, it can effectively prevent copper and other Metal diffusion, and meet the requirements of hot compression welding and brazing. Immersion gold is a chemical reaction that causes gold particles to crystallize and attach to the PCB pads. Because of its weak adhesion, it is also called soft gold. In the PCB prototype process, ENEPIG, nickel electroplated gold and immersion gold all belong to the surface treatment process. The difference is that nickel electroplated nickel is done before the solder mask while ENEPIG and immersion gold are done after the solder mask. What is the work principle of ENEPIG finish in PCB? ENEPIG involves four layers of metal deposited on a PCB surface. These are copper, nickel, palladium and gold. The process of creating an ENEPIG surface finish includes the following steps: Copper Activation In this step, the copper layer that needs protection is selectively activated, which determines the deposition pattern in the electroless nickel plating step. This process is accomplished using a displacement reaction, which makes the copper layer act as a catalytic surface. Electroless Nickel Nickel acts as a barrier layer, preventing copper from interacting with the other metals involved in this plating technology, particularly gold. The layer is deposited on the catalytic copper surface using an oxidation-reduction reaction. The result is a layer that is between 3.0 to 5.0 microns thick. Electroless Palladium The layer of palladium is what differentiates ENEPIG from ENEG surface finish technology, acting as another barrier layer. Palladium prevents the nickel layer from corroding and diffusing into the gold layer. It also acts as an anti-oxidation and anti-corrosion layer. Like nickel, this layer is deposited using an electroless reaction, which uses a chemical oxidation-reduction reaction to cause the nickel surface to react with palladium and form a thin layer. This palladium is deposited on a layer with a thickness of 0.05 to 0.1 microns, depending on the application. Immersion Gold Gold is the final layer added to ENEPIG surfaces, lending the benefits of low contact resistance, protection from friction and resistance to oxidation. Gold also preserves palladium’s solderability. As the name suggests, immersion gold plating services completely immerse the covered PCB, using a displacement reaction where palladium on the PCB dissolves and releases electrons that reduce the gold atoms surrounding it. The gold ions then attach to the surface of the PCB, replacing some palladium ions and resulting in a relatively thin outer layer, between 0.03 and 0.05 microns thick — substantially lower than any other solution using gold plating techniques. Why PCBBUY is professional at ENEPIG? This process is not common because the nickel palladium has certain requirements on the process capacity of the plate plant, so many enterprises cannot find a suitable plate plant. At present, PCBBUY has been fully online nickel palladium process, to solve the problem of enterprises. PCBBUY also supports a variety of complex processes, such as custom laminated structures, ultra thin sheets, large size boards, etc. As a professional PCB manufacturer of 1-8 layers, PCBBUY will continue to solve the problems of various precision boards and difficult boards for customers.

PCB Knowledge ⋅ 10/22/2021 09:33

How to Design PCB Board through 5 Key Design Rules？

PCB design tools have design rules and constraint management systems built into them, and as we tell our kids, the rules are there to keep us from getting hurt. Having a circuit board fail in manufacturing because the components are too close to the edge of the board or because it is too noisy due to the proper trace clearances not being used are extremely frustrating. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } Design rules are in place to ensure that the circuit boards we lay out will avoid these problems and function as intended. In this article, we are going to look at some of the key design rules for PCB layout that will help you avoid these potential issues. If you are interested in PCB design, please check and reads the passage. 1. How to create schematic of PCB? Whether you are generating your design from a template or creating your printed circuit board from scratch, it is probably best to begin with the schematic. Your schematic is similar to the blueprints for your new device, and it is important to understand what is shown in your schematics. First, your schematics show you the following: · Which components are used in your design · How components are connected together · The relationships between groups of components in different schematics The last point above is quite important, as complex designs may use hierarchical schematics. You can enforce significant organization in your new board if you take a hierarchical approach to your design and place different circuit blocks in different schematics. 2. How to assign footprint of PCB? Footprint gives an idea of the actual size of the component. For example, when we put a component on the sand, it will leave its impression there. This imprint is its actual physical size. Some components come in standard packages and the footprints are easy to find. In some cases, we may have to create the footprint manually. Below are the steps to be followed to create a footprint in Altium Designer. · Create the pads · Key-in component height and area · Provide the silk-screen information · Save the footprint 3. How to calculate the track of PCB? The tracks are like wires. They are the elements that allow the electric current to flow in your electronic circuit. As we know, the higher the value of the electric current, the larger the section of a conductor must be, so that it can allow the conduction of current. In the design a PCB, it works with the same principle and therefore, we must perform the proper calculation of the width of the tracks. For this, we will use software that helps in the process of dimensioning the trails. You can access the link on the Digikey website and enter the current and temperature parameters for the project. Later, the website will inform the ideal value of the width of your trail. It is important to highlight that the site is safe and uses the equations of the IPC-2221 standard to calculate the width of the tracks: Access the link and calculate the track width 4. How to upgrade PCB design? With the use of 3D step models, layout teams now have a perspective of PCB design that used to only be possible with mechanical design systems. With the 3D capabilities of CAD tools, PCB designers have a much fuller and comprehensive view of their work, giving them the unique ability to spot unexpected component conflicts and collisions. These tools also give PCB designers the ability to import mechanical design files to check their board against other elements of the entire system design, including other PCBs, cables, and system enclosures. Design rules for PCB layouts can open up a whole new world by allowing you to push up against the technology envelope, but not go past it. This gives you the freedom to consider all possible scenarios in your design without having to worry whether or not your efforts are in violation of design rules. 5. How to process the routing of PCB? Once the basic placement has been completed, the next stage of the PCB design is to route the connections between all the components. The PCB software then routes the physical connections on the board according to the netlist from the schematic. To achieve this it will use the number of layers that are available for connections, creating via holes as required. Often one layer will be allocated for use as a ground plane, and another as a power plane. Not only does this reduce the level of noise, but it enables low source resistance connections to be made for the power. The routing can use a significant amount of computing power. This is particularly true for larger designs where there may be upwards of three or four thousand components. Where routing is difficult as a result of high component density, this can result in the routing taking a significant amount of time.

PCB Knowledge ⋅ 10/22/2021 09:18

7 Aspects of PCB Layout Best Practices to Improve PCB Manufacturing

Whether you are moving at a high speed or you're designing a high speed printed circuit board, good design practices are critical to preventing delays and unnecessary costs. In this article, we outline ten best practices of PCB design, most of which have stayed consistent for 25 years. These rules are in no particular order, can generally be applied to any PCB design project, and should prove as a useful guide both to veteran design engineers as well as makers alike. If you are going to learn more information about PCB layout practice, please check and read the content for more professional knowledge. What are the factors for PCB layout practice? How to improve the manufacturing process of PCB board? Check this passage!If you want to order PCB product, please check and custom your order online. 1. How to interconnecting PCB? Board-to-board connectors, or “headers,” give PCBs the ability to be connected together without the use of wires or a harness. One board will have a connector with pins, while the other board will have the mating receptacle. While variants of these connectors can be used with wiring harnesses, their main benefit of a board-to-board header is providing a short and direct connection between the two circuit boards. Board-to-board connectors are available in many different forms, depending on the needs of the PCBs they are connecting. They come in different packages, mounting styles, and pin pitches. For circuit boards with taller components, a designer can choose a correspondingly taller connector.2. How to process components placement? There are many PCB layout rules to consider during component placement. While general board layout guidelines tell you to place components in order of connectors, power circuits, precision circuits, critical circuits, etc, there are also several specific board layout guidelines to keep in mind. OrientationBe sure to orient similar components in the same direction as this will help with effective routing in PCB design. It also helps ensure an efficient and error-free soldering process during assembly. PlacementAvoid placing components on the solder side of a board that would rest behind plated through-hole components. OrganizationIt’s recommended to place all your surface mount devices (SMD) components on the same side of your board according to SMD PCB design rules. All through-hole (TH) components should be placed on the top side of your board to minimize the number of assembly steps.3. How to fix the location part? The first parts to be placed are those components that have specific locations designated by the mechanical input. These are often connectors, switches, LEDs, or other parts that either mate with other intra-system connections, or require human access.4. How to certain the power supplies? These parts need to be between the connectors that are bringing power onto the board, and those high-current components that they are supplying power to (such as the processor and memory chips). At the same time, the different power supply circuits should have some distance between them to avoid creating thermal hot spots on the board. Additionally, these components need to have some separation from sensitive digital circuitry to avoid contaminating them with power switching noise.5. How to text differential signals? Signals that are exactly the same but with inverted polarity with respect to each other are called differential signals. This is a technique used to reduce the noise and distortion that could be radiated into them through a communication path. A common protocol that uses differential signals to transfer data is USB with signals D+ and D-.To maximize the benefits of a differential pair, these signals must be routed together with traces of the same length and same distance from any solid plane. This is done so both conductive paths have the same impedance.6. What are the considerations of PCB layout? The needs of the circuit board configurations within the system will dictate how the headers will be placed on each individual board. Here are some possibilities to consider: · Boards that need to be parallel with each other will be stacked using straight pin headers.· Boards that need to be side-by-side horizontally will be connected with right-angle headers.· Boards that need to be positioned at right angles to each other will use a combination of a straight pin header on one board and a right angle mating connector on the other.7. How to check the Gerber file? When submitting PCB design files to the manufacturer, it is normally done by sending them files in Gerber format. When you output these files from your PCB Layout software, it is a good idea to visualize them and compare them with your actual design. Sometimes the translation is not exactly the same as in your screen, however, most of the time the differences are insignificant.Wanna know PCB knowledge? Check and read for more.

PCB Knowledge ⋅ 10/22/2021 09:11

5 Key Points of PCB DIP Soldering Process in PCB Manufacturing

Manual immersion tin and semi-automatic/fully automatic welding equipment have been developed. We will step through this process in this article. If you are going to learn more information of PCB DIP soldering, please check and read the content in the article for more professional knowledge. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } 1. What are the benefits of PCB DIP soldering? Then certain essential functions allow you to use these displays for residential and commercial advertisement activities, · High contrast and luminosity · Broad angle of view · Image playback and visuals, motion shown · Rate the number of times an ad has been seen · Online management and planning · Daytime and range do not influence workload The operating capability is not affected by the time of year, weather, and temperature change The stability and long life of the LED show for up to 10 years is one of the biggest advantages. In addition, the show would not stop running, except though part of it is damaged. The defective cluster remains unnoticed. 2. What are the preparations before of PCB DIP soldering? First Article Inspection We will cross check and record all the supplied components’ quantity, item number, dimension, cathode direction, component silkscreen number, value, etc. Components outline processing Some components outline should be processed ahead of time because of their own design or for the PCB DIP soldering requirements and the whole PCB plan. Requests. The horizontal witch of the processed pins should be the same as the locating holes, the tolerance should be < 5%, the silkscreen upward. Components management Preparation before DIP soldering: Every operator should follow team leader’s arrangement, prepare their WI content in their own station and receive all the components which match the WI completely. Put the received components into the part box and mark them well, including the defect parts if there is. Check if there is any cathode components, and compare with the WI picture, should be familiar with the part appearance and find out the pin position. 3. What are the differences of DIP and SMT? SMT only assemble no pins components such as QFN,DFN,BGA package components or short pins components on the PCB surface. It need to print solder paste on the PCB firstly, than use the SMT machine to solder the components, finally via reflow soldering to fix components on PCB. While DIP is solder the through hole package components, and via wave soldering or manual soldering to fix components on PCB. SMT and DIP are all part of the PCB Assembly work, but not all the PCBA companies have good SMT and DIP capability, and the PCB soldering quality are not the same. If you cooperate with a new PCBA factory, I suggest you firstly visit the factory to check the assembly technology, production equipment and so on. 4. What is the process of DIP and SMT? Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications: · Lead–silver is used for strength at higher-than-room temperature. · Tin–lead is used as a general-purpose solder · Tin–zinc is used for aluminium · Cadmium–silver is used for strength at high temperatures · Zinc–aluminium is used for aluminium and corrosion resistance · Tin–silver and tin–bismuth are used for electronics. Because of the toxicity of lead, lead-free solders are being developed and more widely used. The molten bath can be any suitable filler metal, but the selection is usually confined to the lower melting point elements. The most common dip soldering operations use zinc-aluminum and tin-lead solders. 5. What are the features of PCB DIP process? DIP is one of the basic components of electronic components. It is called dual in-line packaging technology, which refers to the integrated circuit chip packaged in the dual in-line form, which is also used in most small and medium-sized integrated circuits. The number of pins generally does not exceed 100. A CPU chip with DIP packaging technology has two rows of pins, which need to be inserted into a chip socket with a DIP structure. Of course, it can also be directly inserted into a circuit board with the same number of solder holes and geometric arrangement for soldering. DIP packaging technology should be especially careful when plugging and unplugging from the chip socket to avoid damage to the pins. Features: multilayer ceramic dual in-line DIP, single-layer ceramic dual in-line DIP, lead frame DIP (including glass ceramic sealing type, plastic encapsulation structure type, ceramic low-melting glass packaging type) and so on.

PCB Knowledge ⋅ 10/21/2021 09:25

What is IC Package Design in the PCB Manufacturing Process?

IC packaging is the last stage in the production of semiconductor devices. During this stage, the semiconductor block gets covered in a package that protects the IC from potentially damaging external elements and the corrosive effects of age. The package is essentially an encasement designed to protect the block and also to promote the electrical contacts that deliver signals to the circuit board of an electronic device. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } In this article, we will focus on IC packaging design. If you are interested in IC packaging, please check and read the content below for more information. What is the basic history of IC packaging? IC packaging technology has evolved since the 1970s when ball grid array (BGA) packages first came into use among electronics packaging manufacturers. At the dawn of the 21st century, newer options in package technologies eclipsed pin grid array packages, namely the plastic quad flat pack and the thin small outline package. As the noughties progressed, manufacturers like Intel ushered in the era of land grid array packages. What materials are needed in IC packaging? The required materials used to build different IC packages are essential. It’s because three factors establish the foundation of a package. And they are: · Chemical properties · Physical properties · Electrical properties · But that’s not all. The performance of the package also acts as a limiting factor. So, let’s dive into the three primary package materials. How to process the virtual prototyping of IC packaging design? Building a digital twin, virtual model of the 2.5D/3D heterogeneous assembly provides a comprehensive representation of the full system comprising multiple devices and substrates. The digital twin enables automated verification of heterogeneous assemblies beginning with substrate-level design rule checking (DRC) and expanding into layout versus schematic (LVS), layout versus layout (LVL), parasitic extraction, stress and thermal analysis, and, finally, test. One of the primary benefits of the digital twin approach is that it serves as the golden reference to drive complete physical and electrical verification at every level of the design hierarchy. That eliminates using multiple, static spreadsheets to represent pin and connectivity information, replacing them with a full, system-level netlist in Verilog format. The preservation and reuse of original data, such as a device’s Verilog description, is key. The biggest risk comes when translation or conversion occurs, such as with a schematic or spreadsheet. If this is done, the “digital thread” is immediately broken, and the risk for connectivity errors skyrockets. How to guarantee multi-domain integration? A digital-twin methodology also enables multi-domain and cross-domain integration. Bringing more complex advanced IC packages to market faster requires highly integrated design and verification — from electronic substrate design to mechanical package heat-spreader and PCB-mounting hardware, including the interrelated aspects of electrical, thermal, test, reliability, and, of course, manufacturability. Without a system-level approach to design and verification, engineers risk experiencing costly re-spins or worse. Synchronization of electrical and mechanical information is essential to ensuring that no physical violations occur when a package is placed within an enclosure or an entire system. The incremental exchange of data during design is fundamental to ensuring ECAD-MCAD compatibility and increased first-pass success. It also aids in the creation of more robust designs while increasing productivity and achieving faster time to market. It is extremely important that both the IC package designer and the custom heat-spreader designer can visualize, explore, and optimize the integration, ideally as an asynchronous process that minimizes cross-domain interruptions. What are the classifications of IC packaging? The die of an IC is a conglomeration of interconnected transistors, resistors, capacitors, and diodes to perform specific functions. Once encapsulated in a suitable package, the internal die connects to external components via the terminals present on the package. Manufacturers like to classify different types of ICs based on the size of the die and the number of gates on it: SSI — Small Scale Integration, containing 3-30 gates on a single chip. MSI — Medium Scale Integration, containing 30-300 gates on a single chip. LSI — Large Scale Integration, containing 300-3000 gates on a single chip. VLSI — Very Large-Scale Integration, containing more than 3000 gates on a single chip. Manufacturers also divide ICs based on the techniques they use for manufacturing them. The division follows three broad classes: Thick and Thin film ICs: Manufacturers integrate the passive components such as resistors and capacitors, leaving out the active components. These thick and thin film ICs are usually a combination of discrete components integrated together. Monolithic ICs: These are the most common type of ICs available today. A monolithic IC consists of discrete components, both active and passive, and the interconnections between them integrated on a single silicon chip.

PCB Knowledge ⋅ 10/21/2021 09:18